meta.json

{
    "workflow_environment":"pyiron",
    "title": "pyiron DAMASK tensile simulation",
    "authors": [
        "Ujjal Saikia <u.saikia@mpie.de>"
    ],
    "description": "Run a DAMASK tensile simulation in pyiron",
    "release": "0.0.1",
    "keywords": [
        "Workflow",
        "DAMASK",
        "Tensile simulation",
        "LAMMPS"
    ],
    "categories":[
        "category1, continuum",
        "category2, atomistics"
    ],
    "steps/codes":[
        "step1, calculation of elastic constants",
        "code1, LAMMPS",
        "step2, macroscopic response",
        "code2, DAMASK"
    ],
    "license": {
        "softwar1": "pyiron is released under the terms of the BSD 3-clause license",
        "softwar1": "LAMMPS is distributed as an open source code under the terms of the GPLv2 license",
        "software2": "DAMASK is ditributed under the GNU Affero General Public License 3 (AGPLv3)"
    },
    "publication": [
        "Janssen, J., Surendralal, S., Lysogorskiy, Y., Todorova, M., Hickel, T., Drautz, R. and Neugebauer, J., 2019. pyiron: An integrated development environment for computational materials science, Computational Materials Science, 163, pp.24-36.",
        "A. P. Thompson, H. M. Aktulga, R. Berger, D. S. Bolintineanu, W. M. Brown, P. S. Crozier, P. J. in 't Veld, A. Kohlmeyer, S. G. Moore, T. D. Nguyen, R. Shan, M. J. Stevens, J. Tranchida, C. Trott, S. J. Plimpton, LAMMPS - a flexible simulation tool for particle-based materials modeling at the atomic, meso, and continuum scales, Comp Phys Comm, 271 (2022) 10817",
        "F. Roters, M. Diehl, P. Shanthraj, P. Eisenlohr, C. Reuber, S.L. Wong, T. Maiti, A. Ebrahimi, T. Hochrainer, H.-O. Fabritius, S. Nikolov, M. Friák, N. Fujita, N. Grilli, K.G.F. Janssens, N. Jia, P.J.J. Kok, D. Ma, F. Meier, E. Werner, M. Stricker, D. Raabe, DAMASK – The Düsseldorf Advanced Material Simulation Kit for modeling multi-physics crystal plasticity, thermal, and damage phenomena from the single crystal up to the component scale, Computational Materials Science, 158, 2019, 420-478"
    ],
    "logo" : "logo_dark.png"
}